Basic Semiconductor Builds Silicon Carbide Module Packaging Production Line Base

On July 28, Basic Semiconductor Co., Ltd. issued an announcement stating that the company signed a general engineering contract with the contractor (i.e., China Construction Second Engineering Bureau Co., Ltd.) for the silicon carbide module packaging production line base project. Accordingly, the contractor agreed to undertake the engineering of the company's silicon carbide module packaging production line base, with the total contract price being RMB 193.3 million.

According to the announcement, the project is located in Pingshan District, Shenzhen, with a total construction area of 59,357.54 square meters. The board of directors of Basic Semiconductor disclosed in the announcement that implementing this project will be beneficial to realizing the company's future operational strategy and supporting the growing downstream market demand for new energy vehicles, intelligent computing centers, photovoltaic energy storage, and more.

This project was filed with the Shenzhen Municipal Development and Reform Commission in April of this year. Its main products include automotive-grade SiC half-bridge/full-bridge modules and molded modules, with a planned annual production capacity of 700,000 units, which can meet the core device requirements for the main inverters of approximately 350,000 new energy vehicles.